Multilayer Boards

We offer various types of multilayer boards with FR4 High-Tg 170 °C and mixed FR4-Rogers constructions, both symmetrical and asymmetrical.

Layer from 4 to 36

	Standard	Special
Max. Board size	485x585 mm (ML4) 458x550 mm (ML6 and above)	510x635 mm
Board thickness	1.0;1.5;1.6;2.0 (mm)	0.063; 0.1; 0.4; 0.5; 0.8; 2.4; 3.0; 3.2; 5.0 (mm) or other on request
Copper thickness	35 (55) ; 70, 105, 140µm	210, 435 µm or other on request

Multi- Layer Constructions

Many varieties of simple and complex multilayer constructions, micro blind / buried vias, and subsequent build-ups are available.

Some samples of the FR4 Inner layers types

0.56 mm 35/35um Tg 130 ° C
0.10 mm 35/35um Tg 130 ° C
0.10 mm 18/18um Tg 130 ° C
0.20 mm 18/18um Tg 130 ° C
0.25 mm 18/18um Tg 130 ° C
Prepreg 1080 thickness 0.07 mm*
Prepreg 2116 thickness 0.12 mm*
Prepreg 7628 thickness 0.19 mm*
* Prepregs from different base material suppliers have different thicknesses. Please, check the base materials data sheets before you make the Stack-up specification list.

Example of board constructions:

In the production of multilayer boards with sub-sequential lamination a special note has to be given to the required final board thickness due to the fact that different materials have different Resin filling, which is a critical factor.

Example of subsequent build-up

Production standards:

- IPC –A-600 Class III ; IPC-6012 A
- PERFAG 2
- UL

Base materials

For many standard applications the classical FR4 material is sufficient, maybe with improved thermo-mechanical characteristics. However, at high frequencies for instance, other materials have to be used. This technology information sheet should provide you with a basic overview of the types of material commonly available on the market, together with their fundamental characteristics, to make it easier for you to choose the right material for your application.

Please refer to the following IPC standards for more information: IPC-4101, IPC-4103, IPC-4204, IPC-4203

Below are the characteristics of some base materials.

Material group	Tg	CTE₂	εr(1MHz/1GHz /10GHz)	Proof Voltage	Surface resistance	CTI	Water absorption	Copper adhesion
(Unit)	°C	ppm/K		KV/m	MΩ	V	%	N/mm
Standard FR4	125°C-140°C	<70	4.7/4.3/-	50	10²	>200	0.06	1.5
Modified FR4	135°C-180°C	<55	4.6/4.2/-	45	10²	>200	0.06	1.5
FR4 Halogen free	150°C-170°C	<40	5.0/4.8/4.6	50	10³	>500	0.06	1.5
BT epoxy	Approx.200°C	<40	4.4/4.1/-	70	10³	>200	0.05	1.6
CE epoxy	Approx.250°C	<25	3.9/3.7/3.5	65	10²	>200	0.05	1.6
Polyimide	220°C-260°C	<55	4.0/3.8/3.8	45	10³	>100	0.3	1
RO4000	Approx.280°C	<45	3.3/3.0/2.8	30	10⁷	>600	0.04	1.0