Flex Boards

Single and double-sided flexible circuits are extremely cost effective interconnection media for low to high volume applications.

Maximum layers Flex 10
Maximum layers Rigid/Flex 20
Sequential Lamination 2 – 6 and more


• High reliability
• Space and mass saving
• Total repeatability
• 3-D packaging system
• Cost reduction
• Improved current carrying capability
• Improved heat dissipation
• Light weight
• Mechanical strength
• Excellent in dynamic applications

Rigid Flex- Multilayer Circuits

This technology offers the designer the scope to achieve highly reliable, compact interconnection and packaging configurations with a substantial reduction in overall system cost. Some of these benefits are associated with the elimination of often expensive connectors and a reduction in the overall time to assemble, test and install in the finished product.


The complexity of these products and issues associated with their manufacture are such that dialogue with our applications and/or product engineers during the design phase is recommended. One of the most crucial steps in achieving high yield rigid-flex is involving the PCB manufacturer early in the process. The cost of manufacture starts with design. An ideal rigid-flex design review team would consist of the mechanical and electrical engineer, PCB designer and PCB process engineer. The mechanical engineer understands the mechanical constraints of the system assembly. When he is teamed with a PCB process engineer, the two can investigate changing bends, adding stiffeners, etc. to maximize the PCB panel real estate and minimize the production costs. Conventionally structured flex-rigid multilayers have inner "flex" layers comprising copper clad polyimide (adhesive or adhesiveless) which are continuous throughout the circuit structure, i.e. contained within the "multilayered" and the "flexing" portions.