We offer various types of multilayer boards with FR4 High-Tg 170 °C and mixed FR4-Rogers constructions, both symmetrical and asymmetrical.
Layers from 4 to 36
| Standard | Special | |
|---|---|---|
| Max. board size | 485x585 mm (ML4) 458x550 mm (ML6 and above) | 510x635 mm |
| Board thickness | 1.0; 1.5; 1.6; 2.0 mm | 0.063; 0.1; 0.4; 0.5; 0.8; 2.4; 3.0; 3.2; 5.0 mm or other on request |
| Copper thickness | 35 (55); 70; 105; 140 µm | 210, 435 µm or other on request |
Multilayer constructions
Many varieties of simple and complex multilayer constructions, micro blind / buried vias, and subsequent build-ups are available.
Some samples of the FR4 inner layer types:
- 0.56 mm 35/35 µm Tg 130 °C
- 0.10 mm 35/35 µm Tg 130 °C
- 0.10 mm 18/18 µm Tg 130 °C
- 0.20 mm 18/18 µm Tg 130 °C
- 0.25 mm 18/18 µm Tg 130 °C
- Prepreg 1080 thickness 0.07 mm*
- Prepreg 2116 thickness 0.12 mm*
- Prepreg 7628 thickness 0.19 mm*
* Prepregs from different base material suppliers have different thicknesses. Please check the base material data sheets before you make the stack-up specification list.
Example of board constructions
In the production of multilayer boards with sequential lamination, special attention has to be given to the required final board thickness, because different materials have a different resin filling, which is a critical factor.
Production standards
- IPC-A-600 Class III; IPC-6012 A
- PERFAG 2
- UL
Base materials
For many standard applications the classical FR4 material is sufficient, maybe with improved thermo-mechanical characteristics. However, at high frequencies for instance, other materials have to be used. This overview of the types of material commonly available on the market, together with their fundamental characteristics, should make it easier for you to choose the right material for your application.
Please refer to the following IPC standards for more information: IPC-4101, IPC-4103, IPC-4204, IPC-4203.
| Material group | Tg (°C) | CTE₂ (ppm/K) | εr (1MHz/1GHz/10GHz) | Proof voltage (KV/m) | Surface resistance (MΩ) | CTI (V) | Water absorption (%) | Copper adhesion (N/mm) |
|---|---|---|---|---|---|---|---|---|
| Standard FR4 | 125°C–140°C | <70 | 4.7/4.3/– | 50 | 10² | >200 | 0.06 | 1.5 |
| Modified FR4 | 135°C–180°C | <55 | 4.6/4.2/– | 45 | 10² | >200 | 0.06 | 1.5 |
| FR4 Halogen free | 150°C–170°C | <40 | 5.0/4.8/4.6 | 50 | 10³ | >500 | 0.06 | 1.5 |
| BT epoxy | Approx. 200°C | <40 | 4.4/4.1/– | 70 | 10³ | >200 | 0.05 | 1.6 |
| CE epoxy | Approx. 250°C | <25 | 3.9/3.7/3.5 | 65 | 10² | >200 | 0.05 | 1.6 |
| Polyimide | 220°C–260°C | <55 | 4.0/3.8/3.8 | 45 | 10³ | >100 | 0.3 | 1.0 |
| RO4000 | Approx. 280°C | <45 | 3.3/3.0/2.8 | 30 | 10⁷ | >600 | 0.04 | 1.0 |
If you are interested in a professional European PCB supplier, please feel free to call me under +49 162 2609836 or send me your request directly to the following email address: kao@pcbexpress.eu
